Having established successful Thin Wall
Packaging conferences in Europe and North America, AMI launches its first Thin Wall Packaging Asia event with a
particular focus on South East Asia. The conference took place from 20 - 21 September 2016 in Singapore.
Thin Wall Packaging
Asia 2016 is an event aimed at the value chain participants in the
thermoformed and injection moulded packaging. The growth of organised retail in
Asia as well as more formalised approach to product branding will have a
significant impact on packaging demand in the region. The industry is in need
of a clearer definition to facilitate the change. The new requirements are
expected to drive the development of fast-cycle lightweight packaging, barrier
packaging for long-life products and packaging with superior decoration (IML).
Thin wall plastic packaging like tubs, cups, pots, trays and clamshells,
provides a means of supplying consumer appeal, convenience and product
For further information on this conference, please contact the Conference Organiser, Kat Langner on:
Email: firstname.lastname@example.org Tel: +44 (0) 117 314 8111.
The conference proceedings for Thin Wall Packaging Asia 2016, including presentations, are now available for purchase: