Multilayer Packaging Films 2014, Applied Market Information"s 5th North American conference for the specialty flexible packaging industry takes place June 24-25, 2014 at the Hyatt Regency O'Hare hotel in the lively city of Chicago, the heart of the packaging industry.
Manufacturing technology is constantly advancing from multilayer co-extrusion to lamination and coating. The flexible packaging markets are also expanding rapidly worldwide with a particular trend as replacement materials for rigid plastics packaging for many products, from detergents to alcoholic beverages to soup in pouches. The layered technology required to ensure long shelf-life comprises structural materials, barrier plastics or aluminium and tie-layers. In addition, there are developments in methods of closing packaging including sealants.
The newly released program, featuring 17 high-level presentations, will examine a wide range of current technical and commercial issues, including new films and materials, barrier properties and testing, production technologies (such as co-extrusion and coating), and applications and markets. An exhibition will take place alongside the conference to enable a broad range of delegates from across the flexible packaging industry to see and handle new products.
The Multilayer Packaging Films program features speakers from PEPSICO, ZIP-PAK, CELPLAST METALLIZED PRODUCTS LTD, WINDMOELLER & HOELSCHER CORPORATION, ALLIED FLEX TECHNOLOGIES, MITSUI CHEMICALS AMERICA, INC., EXXONMOBIL CHEMICAL COMPANY, INTERTEK, NATUR-TEC - A Division of NTIC, DOW CHEMICAL COMPANY, DAVIS-STANDARD LLC, DUPONT INDUSTRIAL BIOSCIENCES, INGENIA POLYMERS, LYONDELLBASELL, UBE EUROPE GmbH, MAMATA EXTRUSION SYSTEMS PVT. LTD., and THERMO FISHER SCIENTIFIC.
This event is sponsored by Ingenia Polymers, Electronic Systems S.p.A., and Polyfil Corporation.
For more information on attending, sponsoring or exhibiting at Multilayer Packaging Films 2014, visit http://www.amiplastics-na.com/events/Event.aspx?code=C586&sec=3977, or contact Amanda Schaeffer at email@example.com or call +1 610 478 0800.
Event: Multilayer Packaging Films 2014
Dates: June 24-25, 2014
Location: Chicago, IL, USA