Applied Market Information has unveiled the programme for the 10th European edition of its Thin Wall Packaging conference. After record-breaking attendance in 2014, this event is expected to continue to attract attendees from across the global supply chain. AMI"s Thin Wall Packaging 2015 will be taking place 1-3 December 2015 in Cologne, Germany. Industry experts will gather at this international conference and exhibition for lightweight plastic tubs, trays, and cups for the food packaging industry.
Thin wall packaging can be used in a wide range of applications. The ambient long-life food sector positioning is challenged with consumer concerns about quality in comparison with the chilled and/or frozen variants. Canned meals are perceived as inferior quality, less fresh and less authentic products. The segment is in need of modernisation, which can be done with the use of new plastic packaging solutions, and their improved process technology to deliver higher quality, long-life food products.
In the opening session on market drivers, the audience will hear the latest about the thin wall packaging industry presented by Sem Plastik while AMI will look back at the industry over the last 10 years and discuss how it has evolved and its current trends.
Ready meals, either chilled or shelf-stable, are a segment of high growth, which triggers innovation in the use of microwave technologies. Microwave pasteurisation, sterilisation and shielding are new concepts that will affect the demand for TWP in the future. Those topics will be discussed in a session including speakers from Micvac, Shieltronics, Avure and 915 Labs. Other presentations will cover the latest on barrier packaging with speakers from Greiner Packaging, Silgan Food Containers and Kuraray.
Improving sustainability is an ever-present challenge for the industry. Coveris will present the future of innovative sustainable packaging solutions, BASF will talk about compostable packaging solutions, while Sabic and Total will review traditional (PS) and currently developing (PP) TWP materials and their environmental impact.
Cobelplast will present an innovation that allows for PP to be used instead of PS in multipack thermoformed packaging. Other material developments discussed at the conference will also include PET (with papers from Perstorp & Mitsubishi Gas Chemical and AMB).
AMI"s Thin Wall Packaging 2015 is relevant for all members of the supply chain including brand owners, retailers, packaging companies, food experts, researchers, test houses, materials and manufacturing experts. In addition to delivering quality papers, the conference also offers superb and cost-effective networking opportunities with its extensive table top exhibition area.
Thin Wall Packaging 2015 is sponsored by Borealis, WM Wrapping Machinery, Kiefel Extrusion, Sabic, Kuraray, Milacron and Bandera Luigi Costruzioni Meccaniche.
The full programme can now be found on AMI's website: www.amiconferences.com. For further information on attending, exhibiting or sponsoring this event please contact Maud Lassara, Senior Conference Organiser at AMI Conferences: on email@example.com or +44 (0) 117 314 8111.