AMI and Compounding World magazine's 2nd edition of Compounding World Congress 2016, took place from 18-20 April at the Maritim Hotel, Cologne, Germany.
Selected by the editorial team of Compounding World, the event’s high-level programme explored and developed many of the magazine’s most popular themes in a live event.
The conference covered business strategies and new materials technologies, as well as providing practical advice on getting the most from compounding lines.
It primarily focused on the production of technical compounds based on engineering thermoplastics, thermoplastic elastomers and performance polyolefins for demanding applications in markets such as the automotive, electrical/electronic, medical and industrial sectors.
Dedicated sessions explored the latest additives and formulations for adding value and new functionality to thermoplastics. In addition, there was an analysis of key market trends in the compounding industry, plus discussions on how to grow business in an increasingly competitive global arena. Experts covered new developments in processing technology and provided tips on how to optimise compounding operations.
Compounding World Congress 2017
24 - 26 April 2017, Maritim Hotel, Cologne, Germany
For more details about attending, exhibiting and sponsoring contact Kat Langner
Email: firstname.lastname@example.org Tel: +44 117 314 8111.
The conference proceedings for the Compounding World Congress 2016 event are now available for sale. Please follow the link below.
Compounding World Congress 2016 - conference proceedings
AMI is pleased to announce the
programme for Compounding World magazine’s 2nd conference in
Europe the Compounding World Congress 2016 .
1. Eight focused conference
sessions covering key industry issues
2. Panel discussion with industry
3. Multiple networking opportunities
4. Exclusive site visit to
the HPF The Mineral Engineers mine and processing facility
To download the conference brochure please click on the link below:
Please enter password or login if you attended the event.
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